机读格式显示(MARC)
- 000 01515cam a2200505 a 4500
- 008 140124r20142010cc a b 001 0 eng d
- 017 __ |a CN |b 08-2013-088
- 020 __ |a 9787560342825 |c CNY98.00
- 040 __ |a PUL |c PUL |d HEU
- 050 _4 |a TA177.4 |b .S85
- 099 __ |a CAL 022014026706
- 245 00 |a Characterization of integrated circuit packaging materials = |b 集成电路封装材料的表征 / |c [editors], Thomas M.Moore, Robert G.McKenna. |s 英文影印版
- 260 __ |a 哈尔滨 : |b Harbin Institute of Technology Press, |c 2014.
- 300 __ |a xx, 274 p. : |b ill. ; |c 26 cm.
- 490 0_ |a Materials characterization serise = |a 材料表征原版系列丛书
- 504 __ |a Includes bibliographical references and index.
- 534 __ |p Reprint. Originally published: |c New York : Momentum Press, 2010. |z 9781606501870.
- 650 _0 |a Integrated circuit technology.
- 700 1_ |a Moore Thomas M.
- 700 1_ |a McKenna, Robert G.