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西文图书1.Characterization of integrated circuit packaging materials = 集成电路封装材料的表征 / TN405/E2
馆藏复本:3
可借复本:0 [editors], Thomas M.Moore, Robert G.McKenna.
Harbin Institute of Technology Press, 2014.
(0) 馆藏
馆藏复本:3
可借复本:0 [editors], Thomas M.Moore, Robert G.McKenna.
Harbin Institute of Technology Press, 2014.
(0) 馆藏